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STMicroelectronics vacancy search engine

Assembly Technologies Device Manager


Vacancy details

General information

Reference

2020-5192  

Job level

50 - Manager/Expert

Position description

Posting title

Assembly Technologies Device Manager

Regular/Temporary

Regular

Job description

To develop packages and/or processes in compliance with customer requirements and to propose advanced packaging solutions to sustain divisional business.

To manage the overall packaging/assembly activities related to new product development

To provide technical expertise on package field, assisting division in matters affecting technical decisions.

Negotiate the overall product definition with Customer and/or divisional representative

Define the Project Timeline, monitor the actual status and implement actions of correction if needed

Profile

Package Development, Project Management, Risk Analysis, DOE (Design of Experiment), Qualification Methodology, Management Of Priorities,  Interpersonal Relationships, Developing People, Empowering People, Knowledge Sharing.

Other skills required are Ability to train, lead, motivate, and focus the team.  Deep knowledge of package technology, flow and system

Experience in interfacing/cooperating internal and external customers

Available for business trip

 

Position localisation

Job location

Europe, Italy, Agrate

Candidate criteria

Education level required

4 - Bachelor degree

Experience level required

6-10 years

Languages

English (2- Business fluent)

Requester

Desired start date

01/01/2020