Functional Block-Based FMEA for Enhanced Risk Management in Semiconductor Front-End Manufacturing

Introduction

The semiconductor industry is the backbone of modern technology. It is fundamental to ensure the yield the reliability and safety of semiconductor manufacturing equipment. This thesis aims to delve into the risk management of the equipment used in the Front-End manufacturing stage of semiconductor production, applying the robust methodology of Failure Modes and Effects Analysis (FMEA).

Objectives

The primary objective of this thesis is to collaborate with process engineers to conduct a comprehensive FMEA, focusing on maximizing coverage by employing and further developing the methodology of functional block based FMEA. The goals are to:

Identify potential failure modes of Front-End manufacturing equipment and their effects on the production of semiconductor devices.
Evaluate the severity, occurrence, and detection of each failure mode to calculate the Risk Priority Number (RPN).
Develop a functional block-based approach to FMEA to enhance the granularity and effectiveness of the analysis.
Propose risk mitigation strategies to improve equipment reliability and process safety.
Methodology

The thesis will adopt a systematic approach:

Literature Review: Study existing FMEA with a focus on their application
Data Collection: Gather data on equipment specifications, historical failure records, and process parameters from the Front-End manufacturing department.
FMEA Execution: Perform a traditional FMEA to create a baseline for comparison.
Functional Block-Based FMEA Development: Design and implement an approach by subdividing the equipment into functional blocks, conducting FMEA for each block, and integrating the results.
Analysis and Optimization: Analyze the data to identify critical risk areas and develop targeted risk mitigation strategies.
Validation: Collaborate with process engineers, quality, and management to validate the proposed strategies
Documentation: Document the methodology, findings, and recommendations in a comprehensive manner.
Expected Outcomes

A detailed risk profile of Front-End semiconductor manufacturing equipment.
A refined FMEA methodology tailored for complex equipment systems.
Practical recommendations for risk mitigation to enhance equipment reliability and safety.
A framework for future research and development in risk management within the semiconductor industry.
Increasing eqFMEA risk coverage

scientific studies: physics, material science, chemical, management engineering,

quality mindset / teamwork.

Ability to collaborate effectively with process engineers and other professionals.

Proactivity: Personal initiative and ability to work independently.
Attention to Detail: Accuracy in analysing and documenting results.
Curiosity and Desire to Learn: Willingness to learn new methodologies and to contribute to the field of risk management.