Package Design M/F

 KEY INFORMATION:

  Location: Europe, Italy, Catania

Type of contract: Regular

Job open date: 27/04/2024

Company department: Package Design

At STMicroelectronics, we are 50,000+ creators and makers of semiconductor technologies. We are a global business that prides itself on diversity - 115+ nationalities and present in 35 countries. 

Our people are at the heart of everything we do, working with customers and partners to create the innovations that enable the technology of tomorrow.  Working at ST means innovating for a future that we want to make smarter, greener, and more sustainable. And doing this in a responsible and sustainable way.

Our technology starts with you. Join us and start the future!

 POSTING PRESENTATION:

Design new product package (including leadframe/substrate specification, BOM definition, MBD issuing, POA issuing) according the design rules manual to match the specifications and/or mission profile defined with external and internal customers.

PROFILE REQUIRED:

•  Experienced in Mechanical design for Semiconductor Power Modules and Package
  - Experienced in back end assembly processes for power module and discretes
  - 2D design software ( AutoCAD )
  - 3D Design software ( Inventor )
  - Office suite
  - Being fluent with English language
  - Flexibility / adaptivity to changing working environment
  The Employment search is addressed to candidates of both genders, under Law 10.04.1991 n. 125, as amended by Legislative Decree n. 198/2006 which guarantees gender equality at work

• Education level required
  5 - Master degree

• Experience level required
  6-10 years
  

• Languages
  English (2- Business fluent)
  
  

CONTACT & APPLY FORM:

 Learn more about STMicroelectronics on: www.st.com