STMicroelectronics vacancy search engine

Package Design M/F


Vacancy details

General information

Reference

2023-28934  

Job level

30 - Graduate Entry Level

Position description

Posting title

Package Design M/F

Regular/Temporary

Regular

Contract duration (nb of months)

12

Job description

To work on Package Development for QFN Platform: relationships with ST Division and external Customer, propose new packages, following development and qualification, up to release to production. Developed package should be in accordance with Customer expectations: quality, timing and cost. Availability for short Trip to ST Assembly Plants.

Profile

Knowledge in Package assembly (basic), good relationship with external Teams (even outside Italy), knowledge in statistics and problem-solving tools. Knowledge of CAD software (AutoCAD and Inventor) and Office tools. Team working.   

Position location

Job location

Europe, Italy, Agrate

Candidate criteria

Education level required

5 - Master degree

Experience level required

2-5 years

Languages

English (2- Business fluent)

Requester

Desired start date

02/01/2023