STMicroelectronics vacancy search engine

Process Engineering M/F

Vacancy details

General information



Job level

40 - Experienced

Position description

Posting title

Process Engineering M/F



Job description

1, To work on Wire Bonding process engineering, driving continuous process improvement plan towards targeting yield, cycle time, equipment throughput and anything that helps to improve quality, service, cost and safety.

2, To manage SMT and Die Attach equipment related projects, develop and establish the right process recipe and conditions for engineering trials and mass production.

3, To do constant monitoring (SPC) and risk assessment (FMEA) with the right use of tools and methodology.

4, To address or troubleshoot all process related problems with the right use of 8D to prevent or eliminate all known and unknown risk and sporadic problems.

5, To establish and provide simple, clear and relevant trainings, working rules or instructions to operators and technicians operating equipment and processes in the right and safe manner.

6, To ensure highest level of attention on new material/package design rules and specification with zero tolerance on deviating from operating procedure and process control limits without authorization.


1, Good knowledge of English, spoken and written.

2, Familiar with production process and related quality tools, fast learner on new technology as well as technical issues.

3, Able to facilitate the communication to assure all technical and quality requirements are implemented in timely manner.

4, Self-motivated with strong sense of ownership and able to work under high pressure.

5, Proactive attitude, more devoted to problem solving than follower and able to manage different tasks in the same time.

Position localisation

Job location

Asia-Pacific, China, Shenzhen

Candidate criteria

Education level required

4 - Bachelor degree

Experience level required

2-5 years


Desired start date