STMicroelectronics vacancy search engine

Plating Process Development Engineer M/F


Vacancy details

General information

Reference

2022-23928  

Job level

40 - Experienced

Position description

Posting title

Plating Process Development Engineer M/F

Regular/Temporary

Regular

Job description

·         To setup plating (Cu/Tin) process.

·         To develop and to industrialize Cu plating process with vertical and horizontal equipment for new packages, introduce materials to meet the quality, yield, and mission of new application.

·         To support assembly of engineering sample for new packages or new technologies.

·         To characterize assemble plating process and materials.

·         To generate and update process specifications, SOP, FMEA and process control plan.

·         To provide technical support when there are critical quality concerns related to assembly EOL material / process.

Profile

·         More than 3 years working experience.

·         Masters/Bachelor’s Degree in Engineering (Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Semiconductor Technology, Material science) or equivalent.

·         Equipped with statistical data analysis, analytical and problem-solving skills especially at plating process.

·         Systematic Problem-Solving methodology e.g., 8D, DMAIC, Process Mapping, Fish Bond, Is/is not…etc.

·         Ability to anticipate issues and challenges and resolving them quickly. Good knowledge and skills in production area.

·         Practice high performance behavior and together work as Team in executing projects & strive for excellent.

Position location

Job location

Asia-Pacific, Malaysia, Muar

Candidate criteria

Education level required

4 - Bachelor degree

Experience level required

2-5 years

Languages

English (2- Business fluent)

Requester

Desired start date

12/11/2021