STMicroelectronics vacancy search engine

Package Development M/F


Vacancy details

General information

Reference

2021-9014  

Job level

40 - Experienced

Position description

Posting title

Package Development M/F

Regular/Temporary

Regular

Job description

Responsibility:

1. Design and implement test plans in a product development environment.
2. Evaluate the electrical and thermal performance of new product and validate design changes to product
3. Research, design, develop, and implement new testing methodologies to support various product performance parameters
4. Research, configure, purchase and install new machine to support expanding test needs
5. Organize and analyze characterization date collected during functional validation, and qualification phase of the product development cycle
6. Research and implement new equipment, process and procedure to support company objectives relative to quality, cost, time to market, and overall product and system performance

Profile

1. Bachelor or above degree in electrical/ mechanical/material engineering
2. 2-5 years of experience in semiconductor manufacturing: power electronics/modules package testing (IGBT/WBG).
3. Wafer level testing and KGD.
4. Experience with electrical test equipment, parametric analyzers/curve tracers, isolation tester, power supplier, oscilloscope.
5. Hands-on knowledge of package reliability requirements, failure analysis techniques

Position localisation

Job location

Asia-Pacific, China, Shenzhen

Candidate criteria

Education level required

4 - Bachelor degree

Experience level required

2-5 years

Requester

Desired start date

06/10/2020